JEDEC/WAFFLE TRAYS
Antistat ensure all our waffle / Integrated Circuit (IC) trays are antistatic. They are available for use as either IC shipping and/or IC baking trays.
All our shipping trays are built in compliance with JEDEC thick and thin standard dimensions. Mid temperature trays can be baked to 140°C while low temperature trays can withstand a maximum sustained temperature of 65°C. Trays are constructed in modified polysulfone (PS) or equivalent for mid-temperature applications and polycarbonate (PC) for low temperature applications because of their high deflection temperature, superior strength, and dimensional stability. All JEDEC waffle trays have the same “X” and “Y” dimensions and are easily stacked for storage and manufacturing.
Antistat offer a range of JEDEC waffle trays from stock, however due to the complexity and number of variations available we only feature our most popular variations online.
View our online range of JEDEC Waffle trays available to buy now.
If you require trays for packaging more complex semiconductor devices, please contact us to request a quote for your specific requirements.
Images show a TQFP type JEDEC tray
JEDEC/WAFFLE TRAYS
Antistat ensure all our waffle / IC trays are antistatic and are available for use as either IC shipping and/or IC baking trays.
All our shipping trays are built in compliance with JEDEC thick and thin standard dimensions. Mid temperature trays can be baked to 140°C while low temperature trays can withstand a maximum sustained temperature of 65°C. Trays are constructed in modified polysulfone (PS) or equivalent for mid-temperature applications and polycarbonate (PC) for low temperature applications because of their high deflection temperature, superior strength, and dimensional stability. All JEDEC waffle trays have the same “X” and “Y” dimensions and are easily stacked for storage and manufacturing.
Antistat offer a range of JEDEC waffle trays from stock, however due to the complexity and number of variations available we only feature our most popular variations online.
View our online range of JEDEC Waffle trays available to buy now.
If you require trays for packaging more complex semiconductor devices, please contact us to request a quote for your specific requirements.
Images show a TQFP type JEDEC tray
Antistat offers trays for the following package types:
| BGA | CABGA | CBGA | CFP |
| CQFP | CSP | DSBGA | EPBGA |
| FBGA | FCBGA | FQFP | LCC |
| LFBGA | LFP | LQFP | MLF |
| PBGA | PGA | PLCC | PQFB |
| QFN | QFP | SOIC | SSOP |
| SVFP | TBGA | THIN TBGA | TQFP |
| TSOP | TSOP I | TSOP II | VFBGA |
To complete your packaging, Antistat also provide a JEDEC tray cover with black dissipative low density polyethylene foam. The static dissipative tray lid is designed for safe handling and transport of products. This product has maximum product protection and is exceptionally easy to use. Our Conductive PCB Hook and Loop Strap is ideal for binding individual packages together safely and securely.
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Jedec/Waffle Trays
Antistat are experts in component and transportation packaging, fill in the form below and one of our sales team will be in touch with you shortly.
