HIGH TEMPERATURE MASKING TAPE
This high temperature masking tape is a polyimide, pressure-sensitive, adhesive tape with silicon resin which shows excellent dielectric insulation properties, high heat resistance and excellent solvent resistance. Offers dimensional stability and excellent electrical and physical properties over a wide range of temperatures. Ideal for masking printed circuit boards during wave solder or solder dip processes, as well as for solder wave masking and electrical insulation. Neither corrosive nor ozone-depleting and is chemical resistant.
A total thickness of 0.070mm and can withstand heat up to 230°C. Uses a silicon resin adhesive that provides excellent solvent resistance, making it suitable for high-temperature applications. Ideal for demanding environments requiring heat and chemical resilience.
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